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At its ongoing MediaTek 2023 summit, the place the silicon maker announced plans to partner with Meta to make chips for AR glasses, the corporate additionally unveiled new RedCap expertise and Filogic options. The brand new connectivity options intention to convey quick wi-fi capabilities to each the following era of good devices and industry-specific options.
One of many new wi-fi applied sciences that MediaTek has launched right this moment is known as RedCap, which makes it simpler for numerous kinds of units to connect with 5G networks. Presently, it is simple for units like smartphones and tablets to connect with 5G community. RedCap is designed to convey the advantages of 5G to units like wearables, AR glasses, and IoT modules.
It goals to supply the benefits of 5G, comparable to sooner information speeds and improved connectivity, to a variety of units whereas being extra energy-efficient. There are two elements at play right here: the M60 modem IP and the MediaTek T300 chipset collection. The MediaTek T300 collection is a particular chip that helps RedCap, whereas the M60 makes use of much less energy in comparison with different 5G options, which is sweet for units with smaller batteries.
Filogic 860 and Filogic 360
Along with the brand new RedCap expertise, MediaTek additionally launched two new Filogic 860 and Filogic 360 chipsets, increasing its Wi-Fi 7 product lineup.
The Filogic 860 is designed for industrial utility. This chipset goals to supply dependable connectivity in busy community environments. It combines a Wi-Fi 7 dual-band entry level with a complicated community processor and options highly effective CPU that helps superior tunneling and safety features. A number of the key options of Filogic 860 embrace:
- 6nm low-power Wi-Fi design.
- Help for dual-band Wi-Fi 7 with speeds as much as 7.2Gbps.
- Twin-band – each 2.4GHz and 5GHz bands.
- Help for added obtain antennas to enhance sign reception.
- Enhanced vary assist with an additional antenna,
However, the Filogic 360 is a small-scale chip designed for client electronics, comparable to PCs, laptops, set-top bins, and streaming units. This chipset options Wi-Fi 7 and twin Bluetooth 5.4 radio for wonderful connectivity. With Wi-Fi 7, the Filogic 360 provides speeds of as much as 2.9Gbps, and it additionally helps BLE audio with built-in DSP for LC3 codec via Bluetooth 5.4. You may anticipate each Filogic chips to hit the market by mid-2024.
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